pcbexpress

PCB capabilities

Layers2, 4, 6
MaterialFR-4, Tg 150
Board size10 × 10 mm – 400 × 500 mm
Thickness0.6 mm, 0.8 mm, 1.0 mm, 1.2 mm, 1.6 mm, 2.0 mm
Outer copper1 oz, 2 oz
Inner copper0.5 oz, 1 oz
Min. trace / space0.127 / 0.127 mm (5 mil)
Min. hole0.3 mm, 0.25 mm, 0.2 mm
Max. hole6.3 mm
Annular ring0.13 mm
Copper to board edge0.3 mm
Hole to hole0.5 mm
Silkscreen to mask0.15 mm; text stroke at least 0.15 mm
Aspect ratio10:1 (thickness / plated hole); above 8:1 needs fab confirmation
ViasTented, untented, filled
Surface finishHASL (lead-free), HASL, ENIG
Solder maskGreen, Blue, Red, Black, White, Yellow, Purple
SilkscreenWhite, Black
Quantity5 – 1000 (5, 10, 20, 30, 50, 100 presets)
Delivery formatSingle boards; customer panel (V-cuts or tabs in the file)
Castellated edges, gold fingersOptional; gold fingers require ENIG
Electrical testEvery board, included
Impedance controlOptional; reference stack-up below, confirmed after the order
FilesGerber RS-274X + Excellon in one .zip; KiCad, Altium and Eagle naming is recognised

Design rule files

Download the limits above as a rule file for your EDA tool. We generate them from this table, so when the table changes the files change too.

Reference stack-up

We calculate impedance on these stack-ups and confirm with the fab's own after the order. Other thicknesses change the core/prepreg split.

4 layers, 1.6 mm
L1 copper35 µm (1 oz)
Prepreg0.21 mm
L2 copper17.5 µm (0.5 oz)
Core1.065 mm
L3 copper17.5 µm (0.5 oz)
Prepreg0.21 mm
L4 copper35 µm (1 oz)
6 layers, 1.6 mm
L1 copper35 µm (1 oz)
Prepreg0.21 mm
L2 copper17.5 µm (0.5 oz)
Core0.40 mm
L3 copper17.5 µm (0.5 oz)
Prepreg0.21 mm
L4 copper17.5 µm (0.5 oz)
Core0.40 mm
L5 copper17.5 µm (0.5 oz)
Prepreg0.21 mm
L6 copper35 µm (1 oz)